Phase change current density control structure

ABSTRACT

A phase change memory element and method of forming the same. The memory element includes first and second electrodes. A first layer of phase change material is between the first and second electrodes. A second layer including a metal-chalcogenide material is also between the first and second electrodes and is one of a phase change material and a conductive material. An insulating layer is between the first and second layers. There is at least one opening in the insulating layer providing contact between the first and second layers.

FIELD OF THE INVENTION

The present invention relates to semiconductor devices, and inparticular phase-change memory devices and methods of forming the same.

BACKGROUND OF THE INVENTION

Non-volatile memories are important elements of integrated circuits dueto their ability to maintain data absent a power supply. Phase changematerials have been investigated for use in non-volatile memory cells.Phase change memory cells include phase change materials, such aschalcogenide alloys, which are capable of stably transitioning betweenamorphous and crystalline phases. Each phase exhibits a particularresistance state and the resistance states distinguish the logic valuesof the memory cell. Specifically, an amorphous state exhibits arelatively high resistance, and a crystalline state exhibits arelatively low resistance.

A typical phase change cell has a layer of phase change material betweenfirst and second electrodes. As an example, the phase change material isa chalcogenide alloy, such as Ge₂Sb₂Te₅ or SbTeAg. See, e.g., Lankhorstet al., Low-cost and nanoscale non-volatile memory concept for futuresilicon chips, NATURE MATERIALS, vol. 4 pp. 347-352 (April 2005).

A portion of the phase change material is set to a particular resistancestate according to the amount of current applied via the electrodes. Toobtain an amorphous state, a relatively high write current pulse (areset pulse) is applied through the phase change cell to melt a portionof the material for a short period of time. The current is removed andthe cell cools rapidly to a temperature below the glass transitiontemperature, which results in the portion of the material having anamorphous phase. To obtain a crystalline state, a lower current writepulse (a set pulse) is applied to the phase change cell for a longerperiod of time to heat the material to a temperature below its meltingpoint. This causes the amorphous portion of the material tore-crystallize to a crystalline phase that is maintained once thecurrent is removed and the cell is rapidly cooled.

A sought after characteristic of non-volatile memory is low powerconsumption. Often, however, phase change memory cells require largeoperating currents. It is therefore desirable to provide a phase changememory cell with reduced current requirements. For phase change memorycells, it is necessary to have a current density that will heat thephase change material past its melting point and quench it in anamorphous state. One way to increase current density is to decrease thesize of a bottom electrode; another way is to deposit small conductivecrystals on the bottom electrode. These methods maximize the currentdensity at the bottom electrode interface to the phase change material.

It would be desirable, however, to maximize the current density at alocation above the bottom electrode in certain applications.

BRIEF SUMMARY OF THE INVENTION

Embodiments of the invention provide phase change memory elements andmethods of forming the same. An exemplary memory element includes firstand second electrodes. A first layer of phase change material is locatedbetween the first and second electrodes. A second layer comprising ametal chalcogenide material is also between the first and secondelectrodes and is one of a phase change material and a conductivematerial. An insulating layer is between the first and second layers.There is at least one opening in the insulating layer providing contactbetween the first and second layers.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other advantages and features of the invention willbecome more apparent from the detailed description of exemplaryembodiments provided below with reference to the accompanying drawingsin which:

FIG. 1 depicts a phase change memory element according to an exemplaryembodiment of the invention;

FIGS. 2A-2H depict the formation of the memory element of FIG. 1 atdifferent stages of processing; and

FIG. 3 is a block diagram of a system including a memory elementaccording to an exemplary embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to variousspecific embodiments of the invention. These embodiments are describedwith sufficient detail to enable those skilled in the art to practicethe invention. It is to be understood that other embodiments may beemployed, and that various structural, logical and electrical changesmay be made without departing from the spirit or scope of the invention.

The term “substrate” used in the following description may include anysupporting structure including, but not limited to, a semiconductorsubstrate that has an exposed substrate surface. A semiconductorsubstrate should be understood to include silicon, silicon-on-insulator(SOI), silicon-on-sapphire (SOS), doped and undoped semiconductors,epitaxial layers of silicon supported by a base semiconductorfoundation, and other semiconductor structures. When reference is madeto a semiconductor substrate or wafer in the following description,previous process steps may have been utilized to form regions orjunctions in or over the base semiconductor or foundation. The substrateneed not be semiconductor-based, but may be any support structuresuitable for supporting an integrated circuit, including, but notlimited to, metals, alloys, glasses, polymers, ceramics, and any othersupportive materials as is known in the art.

The invention is now explained with reference to the figures, whichillustrate exemplary embodiments and throughout which like referencenumbers indicate like features. FIG. 1 depicts an exemplary embodimentof a phase change memory element 100 constructed in accordance with theinvention. The element 100 shown in FIG. 1 is supported over a substrate101. Over the substrate 101 is a first insulating layer 110.

A first electrode 102 and second insulating layer 103 are over the firstinsulating layer 110 and substrate 100. The first electrode 102 can beany suitable conductive material, such as platinum or tungsten, amongothers. The second insulating layer 103 can be a nitride, such assilicon nitride (Si₃N₄); a low dielectric constant material; aninsulating glass; or an insulating polymer; among other materials.

As shown in FIG. 1, a first layer 104 of phase change material,preferably a chalcogenide material, is over the first electrode 102 andthe second insulating layer 103. The first layer 104 is electricallycoupled to the first electrode 102 through an opening in the secondinsulating layer 103. In the illustrated embodiment, the first layer 104is a germanium-telluride layer. Other exemplary chalcogenidecompositions for the first layer 104 include concentrations of Te belowabout 70%. The germanium concentration is preferably above about 10%.The first layer 104 can include additional elements, for exampleantimony. The percentages given are atomic percentages which total 100%of the atoms of the constituent elements. In the illustrated embodiment,the first layer 104 is about 300 Å to about 500 Å thick and is inelectrical contact with the underlying first electrode 102.

A third insulating layer 105 is over the first layer 104. In theillustrated embodiment, the second insulating layer 103 is amorphouscarbon, but other insulating materials can be used. An opening 106extends through the third insulating layer 105 over the phase changematerial of the first layer 104. The opening 106 is at a location suchthat it is at least partially directly above the first electrode 102.The opening 106 has an area smaller than the surface area of the firstelectrode 102. Optionally, there can be more than one opening 106 withinthe insulating layer 105.

Over the third insulating layer 105 and within the opening 106 is asecond layer 107 of metal-chalcogenide material. Alternatively, thesecond layer could be a phase change material, and further can be thesame material as the first layer 104. In the illustrated embodiment, thesecond layer 107 is, for example, a tin-telluride layer having about 50%tin and about 50% tellurium and is about 500 Å to about 700 Å thick.

Although second layer 107 is shown over the chalcogenide material of thefirst layer 104, it should be understood that the orientation of thelayers can be altered. For example, the first layer 104 may be over thesecond layer 107 and within the opening 106.

Over the second layer 107 is a second electrode 108. The secondelectrode 108 can be any suitable conductive material, for example,platinum, among others. Tungsten in the illustrated embodiment.

For operation, a pulse generator 35 is used to apply a reset pulse tothe element 100. The pulse generator 35 can be, for example, memoryaccess circuitry, such as DRAM memory cell access circuitry, amongothers. The reset pulse melts at least a portion of one or more of thegermanium-telluride first layer 104, the layer 107 or the interfacebetween layers 104 and 107. This leaves the melted portion(s) in a highresistance, amorphous state. A set pulse crystallizes at least a portionof the germanium-telluride first layer 104, leaving the first layer 104in a low resistance state. During operation, current 120 is channeledthrough the opening 106 to achieve an increased current density at adistance H from the first electrode 102 and at the interface of thefirst and second layers 104, 107. In the illustrated embodiment, thedistance H is the thickness of the first layer 104. It should beunderstood that the element 100 can be configured such that H is adifferent distance from the first electrode 102. The height H isselected to achieve the increased current density at a desired heightand will depend on the particular material(s) used in the element 100.

FIGS. 2A-2H are cross sectional views of a wafer fragment depicting theformation of the memory element 100 according to an exemplary embodimentof the invention. No particular order is required for any of the actionsdescribed herein, except for those logically requiring the results ofprior actions. Accordingly, while the actions below are described asbeing performed in a specific order, the order is exemplary only and canbe altered if desired. Although the formation of a single memory element100 is shown, it should be appreciated that the memory element 100 canbe one memory element in an array of memory elements, which can beformed concurrently.

As shown by FIG. 2A, a substrate 101 is initially provided. As indicatedabove, the substrate 101 can be semiconductor-based or another materialuseful as a supporting structure as is known in the art. A firstinsulating layer 110 is formed over the substrate 101. A first electrode102 and second insulating layer 103 are formed over the first insulatinglayer 110. The first electrode 102 is formed within an opening in thesecond insulating layer 103 such that the surface of the first electrode102 is exposed. The first insulating layer 110 can be, for example,silicon dioxide. The second insulating layer 103 can be silicon nitride,a low dielectric constant material, or other suitable insulators knownin the art, and may be formed by any method known in the art.

As shown in FIG. 2B, a first layer 104 of phase change material, e.g.,germanium-telluride, is formed over the first electrode 102 and secondinsulating layer 103. Formation of the first layer 104 may beaccomplished by any suitable method. In the depicted embodiment, thefirst layer 104 is formed having a thickness of about 300 Å to about 500Å.

FIG. 2C depicts the formation of the third insulating layer 105. In theillustrated embodiment, the third insulating layer 105 is an amorphouscarbon layer, but other materials may be used. The insulating layer 105is formed at a distance H over the first electrode 102 and can be formedby any suitable technique. In the illustrated embodiment, H is thethickness of the first layer 104. H, however, could be a differentdistance. Additionally, the third insulating layer 105 could instead beformed over more than one layer.

Referring to FIG. 2D, a layer 201 of photoresist is formed over thethird insulating layer 105. The photoresist layer 201 is patterned tohave an opening 206 to expose the insulating layer 105. The opening 206is formed at a location such that the opening 206 is formed at leastpartially directly above the first electrode 102. The size and locationof the opening 206 determines the size and location of the opening 106(FIG. 1) to be formed in the insulating layer 105.

Alternatively, more than one opening 206 can be patterned in thephotoresist layer 201 above the first electrode 102, as shown in FIG.2E. Additionally, an optional process can be used to further reduce thesize of the opening 106 (FIG. 1) that will be formed. For this optionalprocess, a second layer of material 202 is formed over the photoresistlayer 201 and lining the sidewalls of openings 206. Openings 207 areformed in the pattern created by the photoresist layer 201 and thematerial 202 together. Thereby the openings 207 have a reduced size ascompared to the openings 206. Once the openings 207 are formed thematerial 202 is removed.

As depicted in FIG. 2F, the portions of the third insulating layer 105exposed by the opening 206 (or opening 207, in the case of the processdescribed in connection with FIG. 2E) are removed to form opening(s)106. The photoresist layer 201 (and layer 202) are also removed byconventional methods. Hereinafter, the invention is illustrated ashaving one opening 106 for exemplary purposes only.

A second layer 107 of a metal-chalcogenide material, e.g.,tin-telluride, is formed over the third insulating layer 105 and withinthe opening 106, as shown in FIG. 2G. The second layer 107 can be formedby any suitable method, e.g., physical vapor deposition, chemical vapordeposition, co-evaporation, sputtering, among other techniques. In theillustrated embodiment, the second layer 107 is formed having athickness of about 500 Å to about 700 Å.

As illustrated in FIG. 2H, a conductive material is deposited over thesecond layer 107 to form a second electrode 108. Similar to the firstelectrode 102, the conductive material for the second electrode 108 maybe any material suitable for a conductive electrode, for example,platinum or tungsten, among others. In the illustrated embodiment, thelayers 104, 105, 107, 108 are formed as blanket layers.

Although the memory element 100 is shown having first and second layers104, 107, the element 100 can include additional layers of the same ordifferent materials described above between the first and secondelectrodes 102, 108. Further, the insulating layer 105 can be betweenany of the additional layers to achieve an increased current density ata desired distance H from the first electrode 102.

Additional processing steps can be performed, for example, to formconnections to other circuitry of the integrated circuit (e.g., logiccircuitry, sense amplifiers, etc.) of which the memory element 100 is apart, as is known in the art.

FIG. 3 illustrates a processor system 300 which includes a memorycircuit 348, e.g., a memory device, which employs memory array 301,which includes at least one memory element 100 constructed according tothe invention. The processor system 300, which can be, for example, acomputer system, generally comprises a central processing unit (CPU)344, such as a microprocessor, a digital signal processor, or otherprogrammable digital logic devices, which communicates with aninput/output (I/O) device 346 over a bus 352. The memory circuit 348communicates with the CPU 344 over bus 352 typically through a memorycontroller.

In the case of a computer system, the processor system 300 may includeperipheral devices such as a floppy disk drive 354 and a compact disc(CD) ROM drive 356, which also communicate with CPU 344 over the bus352. Memory circuit 348 is preferably constructed as an integratedcircuit, which includes a memory array 301 having at least one memoryelement 100 according to the invention. If desired, the memory circuit348 may be combined with the processor, for example CPU 344, in a singleintegrated circuit.

The above description and drawings are only to be consideredillustrative of exemplary embodiments, which achieve the features andadvantages of the present invention. Modification and substitutions tospecific process conditions and structures can be made without departingfrom the spirit and scope of the present invention. Accordingly, theinvention is not to be considered as being limited by the foregoingdescription and drawings, but is only limited by the scope of theappended claims.

1-46. (canceled)
 47. A single memory element comprising: a first memory material; a second memory material; an insulating material separating at least a portion of the first and second memory materials; and at least two openings in the insulating material allowing contact between the first and second memory materials to define the single memory element.
 48. The memory element of claim 1, wherein the first memory material comprises a chalcogenide material.
 49. The memory element of claim 2, wherein the first memory material comprises germanium-telluride.
 50. The memory element of claim 1, wherein the first memory material has a thickness of about 300 Å to about 500 Å.
 51. The memory element of claim 1, wherein the second memory material comprises a metal-chalcogenide material.
 52. The memory element of claim 5, wherein the second memory material comprises tin-telluride.
 53. The memory element of claim 1, wherein the second memory material has a thickness of about 500 Å to about 700 Å.
 54. The memory element of claim 1, wherein the insulating material comprises amorphous carbon.
 55. The memory element of claim 1, further comprising first and second electrodes, wherein the first and second memory materials are between the first and second electrodes.
 56. The memory element of claim 8, wherein the at least two openings are at least partially directly above the second electrode.
 57. The memory element of claim 1, wherein the at least two openings are configured to increase current density during operation of the element.
 58. The memory element of claim 1, wherein the at least two openings have a surface area less than a surface area of one of the first and second electrodes.
 59. A memory device comprising: a plurality of memory cells, at least one memory cell comprising: a first memory material; a second memory material; an insulating material separating at least a portion of the first and second memory materials; and at least two openings in the insulating material allowing contact between the first and second memory materials to define the single memory element.
 60. The memory device of claim 12, wherein the first memory material comprises a phase change material.
 61. The memory device of claim 13, wherein the phase change material comprises germanium-telluride.
 62. The memory device of claim 12, wherein the first memory material has a thickness of about 300 Å to about 500 Å.
 63. The memory device of claim 12, wherein the second memory material comprises a metal-chalcogenide material.
 64. The memory device of claim 15, wherein the metal-chalcogenide material comprises tin-telluride.
 65. The memory device of claim 12, wherein the metal-chalcogenide material has a thickness of about 500 Å to about 700 Å.
 66. The memory device of claim 12, wherein the insulating material comprises amorphous carbon.
 67. The memory device of claim 12, further comprising first and second electrodes, wherein the first and second memory materials are between the first and second electrodes.
 68. The memory device of claim 18, wherein the at least two openings have a surface area less than a surface area of the second electrode. 